<?xml version="1.0" encoding="utf-8"?>
<!DOCTYPE article PUBLIC "-//NLM//DTD JATS (Z39.96) Journal Publishing DTD v1.3 20210610//EN" "https://jats.nlm.nih.gov/publishing/1.3/JATS-journalpublishing1-3.dtd">
<article article-type="research-article" dtd-version="1.3" xml:lang="ru">
  <front xmlns:xlink="http://www.w3.org/1999/xlink">
    <journal-meta>
      <journal-id journal-id-type="elibrary">https://www.elibrary.ru/title_about_new.asp?i</journal-id>
      <journal-title-group>
        <journal-title>Materials physics and mechanics</journal-title>
        <trans-title-group xml:lang="ru">
          <trans-title>Механика и физика материалов</trans-title>
        </trans-title-group>
      </journal-title-group>
      <issn pub-type="epub">1605-8119</issn>
    </journal-meta>
    <article-meta xmlns:xlink="http://www.w3.org/1999/xlink">
      <article-id pub-id-type="publisher-id">2</article-id>
      <title-group>
        <article-title>Misfit Stress Relaxation through Grain Boundary Diffusion in Nanocrystalline Films</article-title>
        <trans-title-group xml:lang="ru">
          <trans-title>Релаксация напряжений несоответствия путем зернограничной диффузии в нанокристаллических пленках</trans-title>
        </trans-title-group>
      </title-group>
      <contrib-group>
        <contrib contrib-type="author">
          <name>
            <surname>I.A. Ovid’ko</surname>
            <given-names>И.А.</given-names>
          </name>
          <xref ref-type="aff" rid="aff1"/>
        </contrib>
        <contrib contrib-type="author">
          <contrib-id contrib-id-type="orcid">0000-0003-2192-0386</contrib-id>
          <contrib-id contrib-id-type="scopus">7003559440</contrib-id>
          <name>
            <surname>Skiba</surname>
            <given-names>Nikolai</given-names>
          </name>
          <xref ref-type="aff" rid="aff2"/>
          <email>nikolay.skiba@gmail.com</email>
        </contrib>
        <contrib contrib-type="author">
          <contrib-id contrib-id-type="orcid">0000-0001-9909-2950</contrib-id>
          <contrib-id contrib-id-type="scopus">6701854079</contrib-id>
          <contrib-id contrib-id-type="researcherid">113263</contrib-id>
          <name>
            <surname>Sheinerman</surname>
            <given-names>Alexander</given-names>
          </name>
          <xref ref-type="aff" rid="aff1"/>
        </contrib>
      </contrib-group>
      <aff id="aff1">Institute of Problems of Mechanical Engineering RAS</aff>
      <aff id="aff2">Institute for Problems of Mechanical Engineering RAS</aff>
      <pub-date publication-format="electronic" date-type="pub" iso-8601-date="2009-12-31">
        <day>31</day>
        <month>12</month>
        <year>2009</year>
      </pub-date>
      <volume>8</volume>
      <issue>2</issue>
      <fpage>149</fpage>
      <lpage>154</lpage>
      <self-uri xmlns:xlink="http://www.w3.org/1999/xlink" content-type="pdf" xlink:href="https://mpm.spbstu.ru/userfiles/files/MPM_8_2_P02-Rus.pdf"/>
      <abstract xml:lang="en">
        <p>A model is suggested that describes a special micromechanism of misfit stress relaxation in nanocrystalline films, namely misfit stress relaxation through grain boundary diffusion. Within the model, the characteristic time of misfit stress relaxation is estimated for such metallic film/substrate systems as Ni/Cu and Cu/Ag.</p>
      </abstract>
      <kwd-group xml:lang="en">
        <kwd>nanocrystalline materials</kwd>
        <kwd>diffusion</kwd>
        <kwd>films.</kwd>
      </kwd-group>
    </article-meta>
  </front>
</article>
