Misfit Stress Relaxation through Grain Boundary Diffusion in Nanocrystalline Films


A model is suggested that describes a special micromechanism of misfit stress relaxation in nanocrystalline films, namely misfit stress relaxation through grain boundary diffusion. Within the model, the characteristic time of misfit stress relaxation is estimated for such metallic film/substrate systems as Ni/Cu and Cu/Ag.