<?xml version="1.0" encoding="utf-8"?>
<journal>
  <titleid>https://www.elibrary.ru/title_about_new.asp?i</titleid>
  <issn>1605-8119</issn>
  <journalInfo lang="ENG">
    <title>Materials physics and mechanics</title>
  </journalInfo>
  <issue>
    <volume>5</volume>
    <number>1</number>
    <altNumber> </altNumber>
    <dateUni>2002</dateUni>
    <pages>1-60</pages>
    <articles>
      <article>
        <artType>RAR</artType>
        <langPubl>RUS</langPubl>
        <pages>1-10</pages>
        <authors>
          <author num="001">
            <individInfo lang="ENG">
              <orgName>Virginia Commonwealth University</orgName>
              <surname>Rao</surname>
              <address>Richmond, USA</address>
            </individInfo>
          </author>
          <author num="002">
            <individInfo lang="ENG">
              <orgName> Institute of High Temperatures, Russian Academy of Sciences</orgName>
              <surname>Smirnov</surname>
              <address>Moscow, Russia</address>
            </individInfo>
          </author>
        </authors>
        <artTitles>
          <artTitle lang="ENG">Cluster Growth in Expanding Copper Vapor</artTitle>
        </artTitles>
        <abstracts>
          <abstract lang="ENG">Atomic clusters have been proposed as building blocks for tailor-made materials with specific combinations of properties. Growth of such clusters from vapor must be understood to enable one to prepare such materials. Here the process of the cluster growth in expanding copper vapor is analyzed by solving the balance equations for atoms, diatomic molecules, and clusters of different sizes as functions of temperature of buffer gas atoms and clusters. Dependence of the average cluster size at the end of the process on expansion time and the initial number density of atoms is studied. Numerical calculations are performed to obtain the realistic character of change of vapor parameters in a jet nozzle.</abstract>
        </abstracts>
        <codes/>
        <keywords>
          <kwdGroup lang="ENG">
            <keyword>Copper</keyword>
            <keyword>Cluster</keyword>
            <keyword>Growth</keyword>
          </kwdGroup>
        </keywords>
        <files>
          <furl>https://mpm.spbstu.ru/article/2002.7.1/</furl>
          <file>MPM_5_1_P01.pdf</file>
        </files>
      </article>
      <article>
        <artType>RAR</artType>
        <langPubl>RUS</langPubl>
        <pages>11-15</pages>
        <authors>
          <author num="001">
            <individInfo lang="ENG">
              <orgName>IESL/FORTH</orgName>
              <surname>Bender</surname>
              <initials>M.</initials>
              <address>Greece</address>
            </individInfo>
          </author>
          <author num="002">
            <individInfo lang="ENG">
              <orgName>Institute of Electronic Structure and Laser (IESL), Foundation for Research and Technology-Hellas (FO.R.T.H.)</orgName>
              <surname>Katsarakis</surname>
              <initials>N.</initials>
              <address>Heraklion, Greece</address>
            </individInfo>
          </author>
          <author num="003">
            <individInfo lang="ENG">
              <orgName>Institute of Electronic Structure and Laser (IESL), Foundation for Research and Technology-Hellas (FO.R.T.H.)</orgName>
              <surname>Kiriakidis</surname>
              <initials>G.</initials>
              <address>Heraklion, Greece</address>
            </individInfo>
          </author>
          <author num="004">
            <individInfo lang="ENG">
              <orgName>Institute of Problems of Mechanical Engineering RAS</orgName>
              <surname>I.A. Ovid’ko</surname>
              <initials>И.А.</initials>
              <address>St.Petersburg, Russia</address>
            </individInfo>
          </author>
          <author num="005">
            <individInfo lang="ENG">
              <orgName>Institute of Problems of Mechanical Engineering, Russian Academy of Sciences</orgName>
              <surname>Reizis</surname>
              <initials>A.B.</initials>
              <address>St.Petersburg, Russia</address>
            </individInfo>
          </author>
        </authors>
        <artTitles>
          <artTitle lang="ENG">Physical Mechanisms of Enhanced Conductivity in Irradiated InOx Nanocrystalline Films</artTitle>
        </artTitles>
        <abstracts>
          <abstract lang="ENG">We present experimental data on the conductivity evolution in InOx nanocrystalline (nano-grained) films after UV light irradiation, and its dependence on film thickness. These experimental data are indicative of new irradiation-induced effects in the nanocrystalline matter and used as input in elaboration of a theoretical model describing physical mechanisms of the UV light irradiation-induced enhancement of the conductivity in nanocrystalline films. In the framework of the model, the experimentally detected peculiarities of InOx nanocrystalline films are attributed to the presence of high-density ensembles of grain boundaries in such films. In particular, the enhancement of conductivity in these films is theoretically described as a phenomenon related to irradiation-induced structural transformations of grain boundaries and ionization, whose intensities are highly sensitive to the film thickness.</abstract>
        </abstracts>
        <codes/>
        <keywords>
          <kwdGroup lang="ENG">
            <keyword>Nanocrystalline Films</keyword>
            <keyword>Conductivity</keyword>
            <keyword>Irradiated Films</keyword>
          </kwdGroup>
        </keywords>
        <files>
          <furl>https://mpm.spbstu.ru/article/2002.7.2/</furl>
          <file>MPM_5_1_P02.pdf</file>
        </files>
      </article>
      <article>
        <artType>RAR</artType>
        <langPubl>RUS</langPubl>
        <pages>16-22</pages>
        <authors>
          <author num="001">
            <individInfo lang="ENG">
              <orgName>Naval Research Laboratory</orgName>
              <surname>Pande</surname>
              <initials>C.S.</initials>
              <address>USA</address>
            </individInfo>
          </author>
          <author num="002">
            <individInfo lang="ENG">
              <orgName>Naval Research Laboratory</orgName>
              <surname>Masumura</surname>
              <initials>R.A.</initials>
              <address>USA</address>
            </individInfo>
          </author>
          <author num="003">
            <individInfo lang="ENG">
              <orgName>U.E.S. Inc.</orgName>
              <surname>Hazzledine</surname>
              <address>Dayton, USA</address>
            </individInfo>
          </author>
        </authors>
        <artTitles>
          <artTitle lang="ENG">Yield Stress of Nanocrystalline Materials</artTitle>
        </artTitles>
        <abstracts>
          <abstract lang="ENG">Modeling of strengthening by nanocrystalline materials need consideration of both dislocation interactions and sliding due to Coble creep acting simultaneously. Such a mechanism is considered in this paper. It is shown that a model based on using Coble creep (with a threshold stress) for finer grains and conventional Hall-Petch strengthening for larger grains, appears to be most successful in explaining experimental results provided a grain size distribution is incorporated into the analysis to account for a distribution of grain sizes occurring in most specimens. Use of an alternate formalism of Coble creep proposed recently gives a somewhat less satisfactory agreement with experiments.</abstract>
        </abstracts>
        <codes/>
        <keywords>
          <kwdGroup lang="ENG">
            <keyword>Nanocrystalline Materials</keyword>
            <keyword>Modeling of strengthening</keyword>
            <keyword>Yield Stress</keyword>
          </kwdGroup>
        </keywords>
        <files>
          <furl>https://mpm.spbstu.ru/article/2002.7.3/</furl>
          <file>MPM_5_1_P03.pdf</file>
        </files>
      </article>
      <article>
        <artType>RAR</artType>
        <langPubl>RUS</langPubl>
        <pages>23-30</pages>
        <authors>
          <author num="001">
            <individInfo lang="ENG">
              <orgName>Ufa State Aviation Technical University</orgName>
              <surname>Zhilyaev</surname>
              <initials>Alexandr P.</initials>
              <address>Ufa, Russia</address>
            </individInfo>
          </author>
          <author num="002">
            <individInfo lang="ENG">
              <orgName>Ufa State Aviation Technical University</orgName>
              <surname>Nurislamova </surname>
              <address>Ufa, Russia</address>
            </individInfo>
          </author>
          <author num="003">
            <individInfo lang="ENG">
              <orgName>Universitat Autònoma de Barcelona</orgName>
              <surname>Suriñach</surname>
              <address>Bellaterra, Spain</address>
            </individInfo>
          </author>
          <author num="004">
            <individInfo lang="ENG">
              <orgName>Universitat Autònoma de Barcelona</orgName>
              <surname>Baró</surname>
              <address>Bellaterra, Spain</address>
            </individInfo>
          </author>
          <author num="005">
            <individInfo lang="ENG">
              <orgName>University of Southampton</orgName>
              <surname>Langdon</surname>
              <initials>T.G.</initials>
              <address>U.K.</address>
            </individInfo>
          </author>
        </authors>
        <artTitles>
          <artTitle lang="ENG">Calorimetric Measurements of Grain Growth in Ultrafine-Grained Nickel</artTitle>
        </artTitles>
        <abstracts>
          <abstract lang="ENG">The process of grain growth in ultrafine-grained nickel was studied using differential scanning calorimetry. Samples of nickel, with mean grain sizes in the range from 100 to 400 nm, were prepared by equal-channel angular pressing, high pressure torsion or combinations of both. It is shown using differential scanning calorimetry that grain growth in these structures begins at temperatures in the range from 500 to 700K and the measured activation energy for grain growth is close to the activation energy for grain boundary self-diffusion. There was also evidence for a decreasing activation energy in the samples prepared by high pressure torsion.</abstract>
        </abstracts>
        <codes/>
        <keywords>
          <kwdGroup lang="ENG">
            <keyword>Ultrafine-Grained Nickel</keyword>
            <keyword>Grain Growth</keyword>
            <keyword>Calorimetric Measurements</keyword>
          </kwdGroup>
        </keywords>
        <files>
          <furl>https://mpm.spbstu.ru/article/2002.7.4/</furl>
          <file>MPM_5_1_P04.pdf</file>
        </files>
      </article>
      <article>
        <artType>RAR</artType>
        <langPubl>RUS</langPubl>
        <pages>31-38</pages>
        <authors>
          <author num="001">
            <individInfo lang="ENG">
              <orgName>Institute of Electron Technology</orgName>
              <surname>Misiuk</surname>
              <initials>Andrzej</initials>
              <address>Warsaw, Poland</address>
            </individInfo>
          </author>
          <author num="002">
            <individInfo lang="ENG">
              <orgName>Polish Academy of Sciences</orgName>
              <surname>Bak - Misiuk</surname>
              <address>Warsaw, Poland</address>
            </individInfo>
          </author>
          <author num="003">
            <individInfo lang="ENG">
              <orgName>Institute of Electron Technology</orgName>
              <surname>Kaniewska</surname>
              <address>Warsaw, Poland</address>
            </individInfo>
          </author>
          <author num="004">
            <individInfo lang="ENG">
              <orgName>Institute of Semiconductor Physics, RAS</orgName>
              <surname>Zhuravlev</surname>
              <address>Novosibirsk, Russia</address>
            </individInfo>
          </author>
          <author num="005">
            <individInfo lang="ENG">
              <orgName>CNR - IMETEM</orgName>
              <surname>Raineri</surname>
              <address>Catania, Italy</address>
            </individInfo>
          </author>
          <author num="006">
            <individInfo lang="ENG">
              <orgName>Institute of Semiconductor Physics, RAS</orgName>
              <surname>Antonova</surname>
              <address>Novosibirsk, Russia</address>
            </individInfo>
          </author>
        </authors>
        <artTitles>
          <artTitle lang="ENG">Nanostructured Layers in High Temperature - Pressure Treated Silicon Implanted with Hydrogen / Helium</artTitle>
        </artTitles>
        <abstracts>
          <abstract lang="ENG">Structural, electrical and photoluminescence properties of single crystalline silicon implanted with hydrogen and helium, Si:H and Si:He (ion doses ≤ 5. 1016 cm-2, energy, E ≤ 200 keV) and subjected to annealing at up to 1470K under hydrostatic pressure up to 1.2 GPa were investigated. The temperature - pressure (HT - HP) treatment of Si:H and Si:He results in creation of nanostructured buried layers containing gas - filled cavities and numerous extended and point defects; the HT - HP treated Si:H structures are not splitted contrary to those annealed under atmospheric pressure. The HT - HP induced effects are related to creation of smaller, nanometer - sized structural defects and to retarded out - diffusion of hydrogen and helium at HP. The buried layers are active in respect of oxygen gettering. The Si:H and Si:He samples indicate visible photoluminescence after subjecting to specific HT - HP treatment.</abstract>
        </abstracts>
        <codes/>
        <keywords>
          <kwdGroup lang="ENG">
            <keyword>Silicon</keyword>
            <keyword>Si</keyword>
            <keyword>Nanostructured Layers</keyword>
            <keyword>Single crystalline layers</keyword>
          </kwdGroup>
        </keywords>
        <files>
          <furl>https://mpm.spbstu.ru/article/2002.7.5/</furl>
          <file>MPM_5_1_P05.pdf</file>
        </files>
      </article>
      <article>
        <artType>RAR</artType>
        <langPubl>RUS</langPubl>
        <pages>39-42</pages>
        <authors>
          <author num="001">
            <individInfo lang="ENG">
              <orgName>Institute of Solid State Physics</orgName>
              <surname>Straumal</surname>
              <initials>B.B.</initials>
              <address>Moscow, Russia</address>
            </individInfo>
          </author>
          <author num="002">
            <individInfo lang="ENG">
              <orgName>Institute of Solid State Physics</orgName>
              <surname>Vershinin</surname>
              <address>Moscow, Russia</address>
            </individInfo>
          </author>
          <author num="003">
            <individInfo lang="ENG">
              <orgName>Institute of Solid State Physics</orgName>
              <surname>Asrian</surname>
              <address>Moscow, Russia</address>
            </individInfo>
          </author>
          <author num="004">
            <individInfo lang="ENG">
              <orgName>TECHNION-Israel Institute of Technology</orgName>
              <surname>Rabkin</surname>
              <address>Haifa, Israel</address>
            </individInfo>
          </author>
          <author num="005">
            <individInfo lang="ENG">
              <orgName>University of Bremen</orgName>
              <surname>Kroeger</surname>
              <address>Bremen, Germany</address>
            </individInfo>
          </author>
        </authors>
        <artTitles>
          <artTitle lang="ENG">Nanostructured Vacuum ARC Deposited Titanium Coatings</artTitle>
        </artTitles>
        <abstracts>
          <abstract lang="ENG">Ti coatings on silicate glass substrates have been produced using a nonfiltered vacuum arc deposition technique. The dependence of the deposition rate on the distance from the cathode both in lateral and transversal directions was investigated. The average roughness, Ra , decreases with the distance, showing a transition area between the microparticle-containing and microparticle-free Ti films. Ra depends strongly on the number of microparticles. A linear dependence of Ra on the discharge current was obtained only for substrates far enough from the cathode. For substrates close to the cathode the dependence is governed by the microparticle density. Transmission electron microscopy (TEM) reveals dense structure with nanograins.</abstract>
        </abstracts>
        <codes/>
        <keywords>
          <kwdGroup lang="ENG">
            <keyword>Titanium Coatings</keyword>
            <keyword>Nanostructured Coatings</keyword>
          </kwdGroup>
        </keywords>
        <files>
          <furl>https://mpm.spbstu.ru/article/2002.7.6/</furl>
          <file>MPM_5_1_P06.pdf</file>
        </files>
      </article>
      <article>
        <artType>RAR</artType>
        <langPubl>RUS</langPubl>
        <pages>43-46</pages>
        <authors>
          <author num="001">
            <individInfo lang="ENG">
              <orgName>Institute of Silicate Chemistry, Russian Academy of Sciences</orgName>
              <surname>Vasilyeva</surname>
              <address>St.Petersburg, Russia</address>
            </individInfo>
          </author>
          <author num="002">
            <individInfo lang="ENG">
              <orgName>Institute of Silicate Chemistry, Russian Academy of Sciences</orgName>
              <surname>Morozova</surname>
              <address>St.Petersburg, Russia</address>
            </individInfo>
          </author>
          <author num="003">
            <individInfo lang="ENG">
              <orgName>Institute of Silicate Chemistry, Russian Academy of Sciences</orgName>
              <surname>Lapshin</surname>
              <address>St.Petersburg, Russia</address>
            </individInfo>
          </author>
          <author num="004">
            <individInfo lang="ENG">
              <orgName>Institute Silicate Chemistry of Russian Academy of Science</orgName>
              <surname>Konakov</surname>
              <initials>V.G.</initials>
              <address>St.Petersburg, Russia</address>
            </individInfo>
          </author>
        </authors>
        <artTitles>
          <artTitle lang="ENG">Ceramic Materials with Controlled Porosity</artTitle>
        </artTitles>
        <abstracts>
          <abstract lang="ENG">The precursors for magnesium aluminate spinel were synthesized by the method of joint crystallization from mixed solutions of magnesium and aluminum salts. The sequence of the MgAl2 O4 phase formation vs starting reagents was studied. Spinel materials with controlled porosity were obtained using the variation of the Al source at nano-sized precursors synthesis, the changes of the sintering regimes and the introducing combustible additive of carbon and sintering aids into the blend. The optimal regimes for the sintering of the ceramic spinel materials with more than 50% porosity were determined.</abstract>
        </abstracts>
        <codes/>
        <keywords>
          <kwdGroup lang="ENG">
            <keyword>Ceramic Materials</keyword>
            <keyword>MgAl2O4</keyword>
            <keyword>Method of joint crystallization from mixed solutions</keyword>
          </kwdGroup>
        </keywords>
        <files>
          <furl>https://mpm.spbstu.ru/article/2002.7.7/</furl>
          <file>MPM_5_1_P07.pdf</file>
        </files>
      </article>
      <article>
        <artType>RAR</artType>
        <langPubl>RUS</langPubl>
        <pages>49-55</pages>
        <authors>
          <author num="001">
            <individInfo lang="ENG">
              <orgName>Institute of Problems of Mechanical Engineering RAS</orgName>
              <surname>Fedorov</surname>
              <address>St.Petersburg, Russia</address>
            </individInfo>
          </author>
          <author num="002">
            <authorCodes>
              <researcherid>N-7717-2016</researcherid>
              <scopusid>7005519053</scopusid>
              <orcid>0000-0003-4116-4821</orcid>
            </authorCodes>
            <individInfo lang="ENG">
              <orgName>Institute of Problems of Mechanical Engineering RAS</orgName>
              <surname>Kolesnikova</surname>
              <initials>Anna</initials>
              <email>anna.kolesnikova.physics@gmail.com</email>
              <address>St. Petersburg, Russia</address>
            </individInfo>
          </author>
          <author num="003">
            <individInfo lang="ENG">
              <orgName>Institute of Problems of Mechanical Engineering RAS</orgName>
              <surname>I.A. Ovid’ko</surname>
              <initials>И.А.</initials>
              <address>St.Petersburg, Russia</address>
            </individInfo>
          </author>
        </authors>
        <artTitles>
          <artTitle lang="ENG">Grain Boundary Dislocation Structures near Triple Junctions in Nano- and Polycrystalline Materials</artTitle>
        </artTitles>
        <abstracts>
          <abstract lang="ENG">A theoretical model is suggested which describes structural and behavioral features of grain boundary dislocation configurations near triple junctions in nano- and polycrystalline materials. With the elastic interaction between grain boundary dislocations taken into account, we have theoretically examined deviations of spatial arrangement of boundary dislocations near triple junctions, from a periodic arrangement. Also, the local migration of grain boundaries near their triple junctions has been theoretically described, induced by grain boundary sliding in mechanically loaded nano- and polycrystalline materials. In the framework of the model, the key driving force for the local migration is a release of the elastic energy of ensemble of gliding boundary dislocations (carriers of grain boundary sliding) and immobile boundary dislocations (associated with grain boundary misorientation). It is shown that migration is capable of effectively enhancing grain boundary sliding, in which case the combined effects of grain boundary sliding and migration near triple junctions cause plastic flow localization in fine-grained materials, reported in the literature.</abstract>
        </abstracts>
        <codes/>
        <keywords>
          <kwdGroup lang="ENG">
            <keyword>Grain Boundary</keyword>
            <keyword>Dislocations</keyword>
            <keyword>Triple Junctions</keyword>
            <keyword>Nanocrystalline Materials</keyword>
            <keyword>Polycrystalline Materials</keyword>
          </kwdGroup>
        </keywords>
        <files>
          <furl>https://mpm.spbstu.ru/article/2002.7.8/</furl>
          <file>MPM_5_1_P08.pdf</file>
        </files>
      </article>
      <article>
        <artType>RAR</artType>
        <langPubl>RUS</langPubl>
        <pages>56-60</pages>
        <authors>
          <author num="001">
            <individInfo lang="ENG">
              <orgName>Universität Wuppertal</orgName>
              <surname>Körbes</surname>
              <address>Wuppertal, Germany</address>
            </individInfo>
          </author>
          <author num="002">
            <individInfo lang="ENG">
              <orgName>Universität Wuppertal</orgName>
              <surname>Balk</surname>
              <address>Wuppertal, Germany</address>
            </individInfo>
          </author>
          <author num="003">
            <individInfo lang="ENG">
              <orgName>Institut für Physikalische Chemie und Elektrochemie</orgName>
              <surname>Schultze</surname>
              <address>Düsseldorf, Germany</address>
            </individInfo>
          </author>
        </authors>
        <artTitles>
          <artTitle lang="ENG">Nanostructuring of Polymers in Liquid by the Use of Polymer Crazing</artTitle>
        </artTitles>
        <abstracts>
          <abstract lang="ENG">The development of nanostructures is usually based on UV- or DUV-lithography. Using these techniques, a new set of lithographic masks has to be generated for each step in development. Other methods to create nanostructures are the direct writing techniques like ebeam, but this techniques suffer from very high installation and operation costs. To overcome these cost and time intensive procedures we have developed an in-situ technique which allows to write lateral structures with a resolution of 80 nm over an area of up to 100 µm in square with simultaneous characterization. This method is based on a conventional scanning force microscope modified for the use in a development liquid onto a commercial available PMMA/MA e-beam resist and is independent of the substrate material. Specific variations of the tip force which define the depth of structuring allow even structures with oblique faces. Furthermore it has to be emphasized that negative structures can be processed on the in fact positive resist. The created patterns could act as templates for the deposition of e.g. metals or alloys. This can be followed by further lithographic processes of the presented method. For the structuring a completely new mechanism is used. The polymer chains are not cracked as in e-beam lithography, but the crazing of the polymer is used. With new experiments we can prove the fundamentals of the presented technique. In this presentation we will illustrate the feasibilities of this method with respect to electrochemical applications on several examples.</abstract>
        </abstracts>
        <codes/>
        <keywords>
          <kwdGroup lang="ENG">
            <keyword>Polymer</keyword>
            <keyword>Nanostructuring</keyword>
            <keyword>UV-lithography</keyword>
            <keyword>DUV-lithography</keyword>
          </kwdGroup>
        </keywords>
        <files>
          <furl>https://mpm.spbstu.ru/article/2002.7.9/</furl>
          <file>MPM_5_1_P09.pdf</file>
        </files>
      </article>
    </articles>
  </issue>
</journal>
